LNP™ THERMOCOMP™ Compound DF006HL

LNP THERMOCOMP DF006HL compound is based on Polycarbonate (PC) resin containing 30% glass fiber. Added features of this grade include: Low Extractables, Healthcare.

Product Family

  • LNP™ COMPOUNDS AND PC COPOLYMER RESINS

Polymer Family

  • Polycarbonate (PC)

Processing Technology

  • Injection Molding