ENABLING MINIATURIZATION FOR BURN-IN TEST SOCKETS(BITS)
Continued miniaturization of integrated circuits (ICs) are driving the need for new material solutions to support advanced designs for fine-pitch components that are used under extremely harsh conditions, including high temperature, high pressures and multiple cycles of use.
SABIC’s glass fiber reinforced Superflow ULTEM
SF2250EPR and SF2270 resins feature exceptional flow properties for molding thin-wall, high-precision, and miniaturized BiTS products. The high flow performance can reduce the number of gates resulting in less breakage and higher production yields.
Other potential applications for this material include cassettes, IC process carriers, FOUPs and gas/liquid transport system components.
SUPERFLOW ULTEM RESIN OFFERS:
• Up to 5x times higher flow than standard 20% glass filled ULTEM resin
• Balanced flow, ductility and weld line strength
• Fine pitch, thin-wall molding capability
• Inherent flame resistance, UL94 V-0 @1.5mm in black and natural colors
• Chemical resistance against solvents and detergents
• Low outgassing and high cleanliness
• Low and stable dielectric properties, Dk and Df
Superflow ULTEM Resin:
• SF2270: Super high flow, UL94 V0 listing @ 1.5mm
• SF2250EPR: Balanced high flow and ductility, UL94 V0 listing @ 1.5mm
Superflow (SF) Series vs. Glass Filled LCP:
• Greater weld line strength
• Balanced stiffness and ductility
Superflow (SF) Series vs. Glass Filled PES:
• Similar or better flow and better ductility
• Higher strength and modulus (up to 20%)
• Lower specific gravity (up to 9%)
• Lower moisture absorption
• Lower Dk/Df, better dielectric performance
PRODUCTS AND GRADES
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