LNP™ KONDUIT™ Compound DTK22

LNP KONDUIT DTK22 compound is based on Polycarbonate (PC) resin containing minerals. Added features of this grade include: Thermally Conductive and Electrically Insulative.

Product Family

LNP™ COMPOUNDS AND PC COPOLYMER RESINS

Polymer Family

Polycarbonate (PC)

Processing Technology

Injection Molding

Where to buy

You can get in touch with us in these regions to buy the material

Colors

All colors are customizable. Refer our ColorXpress tool to check color availability

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Features

Key characteristics of the material

Thermally Conductive
Thermally conductive/Electrically isolative

Industry

Material previously used in

Building Component
Electrical
Home Appliances
Lighting
Material Handling
Mobile Phone - Computer - Tablets

Applications

Possible usage of material

Photo/Video Camera
Wearables
Wireless Communications

Technical Datasheet Data

View different characteristics of the material at a standard test conditions

Region

ELECTRICAL

PROPERTIES	TYPICAL VALUES	UNITS	TEST METHODS
Dielectric Constant (Dk), 1.1 GHz	3.66	-	ASTM ES 7-83
Dissipation Factor (Df), 1.1 GHz	0.0094	-	ASTM ES 7-83

FLAME CHARACTERISTICS

PROPERTIES	TYPICAL VALUES	UNITS	TEST METHODS
UL Yellow Card Link	View	-	-
UL Recognized, 94HB Flame Class Rating	≥0.5	mm	UL 94
Glow Wire Flammability Index, 0.8 mm	850	°C	IEC 60695-2-12
Glow Wire Flammability Index, 1.0 mm	875	°C	IEC 60695-2-12
Glow Wire Ignitability Temperature, 0.8 mm	850	°C	IEC 60695-2-13
Glow Wire Ignitability Temperature, 1.0 mm	850	°C	IEC 60695-2-13

IMPACT

PROPERTIES	TYPICAL VALUES	UNITS	TEST METHODS
Izod Impact, unnotched, 23°C	700	J/m	ASTM D4812
Izod Impact, notched, 23°C	150	J/m	ASTM D256
*Izod Impact, unnotched 80104 +23°C*	41	kJ/m²	ISO 180/1U
*Izod Impact, notched 80104 +23°C*	13	kJ/m²	ISO 180/1A

INJECTION MOLDING

PROPERTIES	TYPICAL VALUES	UNITS
Drying Temperature	120	°C
Drying Time	2 - 4	Hrs
Maximum Moisture Content	0.02	%
Melt Temperature	260 - 300	°C
Nozzle Temperature	260 - 290	°C
Front - Zone 3 Temperature	260 - 290	°C
Middle - Zone 2 Temperature	260 - 290	°C
Rear - Zone 1 Temperature	250 - 280	°C
Hopper Temperature	60 - 80	°C
Mold Temperature	80 - 120	°C

MECHANICAL

PROPERTIES	TYPICAL VALUES	UNITS	TEST METHODS
Tensile Stress, brk, Type I, 5 mm/min	41	MPa	ASTM D638
Tensile Strain, brk, Type I, 5 mm/min	5	%	ASTM D638
Tensile Modulus, 5 mm/min	3830	MPa	ASTM D638
Flexural Stress, yld, 1.3 mm/min, 50 mm span	79	MPa	ASTM D790
Flexural Stress, brk, 1.3 mm/min, 50 mm span	77	MPa	ASTM D790
Flexural Modulus, 1.3 mm/min, 50 mm span	3160	MPa	ASTM D790
Tensile Stress, break, 5 mm/min	42	MPa	ISO 527
Tensile Strain, break, 5 mm/min	4.1	%	ISO 527
Tensile Modulus, 1 mm/min	3880	MPa	ISO 527
Flexural Stress, break, 2 mm/min	81	MPa	ISO 178
Flexural Modulus, 2 mm/min	4180	MPa	ISO 178
Impact Strength	13 - 48	kJ/m²	ISO R179

PHYSICAL

PROPERTIES	TYPICAL VALUES	UNITS	TEST METHODS
Density	1.46	g/cm³	ASTM D792
Mold Shrinkage, flow, 24 hrs	0.41	%	ASTM D955
Mold Shrinkage, xflow, 24 hrs	0.39	%	ASTM D955
Moisture Absorption (23°C / 50% RH)	0.03	%	ISO 62

THERMAL

PROPERTIES	TYPICAL VALUES	UNITS	TEST METHODS
HDT, 0.45 MPa, 3.2 mm	127	°C	ASTM D648
HDT, 1.82 MPa, 3.2 mm	121	°C	ASTM D648
CTE, 40°C to 120°C, flow	5.3E-05	1/°C	ASTM E831
CTE, 40°C to 120°C, xflow	8.5E-05	1/°C	ASTM E831
*Thermal Conductivity through-plane, 60603mm plaque*	0.3	W/m-K	ISO 22007-2
*Thermal Conductivity in-plane, 60603mm plaque*	1.3	W/m-K	ISO 22007-2
*Thermal Conductivity through-plane, 10103mm sample*	0.6	W/m-K	ASTM E1461-07
*Thermal Conductivity in-plane, 250.4mm disc**	2	W/m-K	ASTM E1461-07
*HDT/Bf, 0.45 MPa Flatw 80104 sp=64mm*	128	°C	ISO 75/Bf
*HDT/Af, 1.8 MPa Flatw 80104 sp=64mm*	119	°C	ISO 75/Af
Relative Temp Index, Elec	80	°C	UL 746B
Relative Temp Index, Mech w/impact	80	°C	UL 746B
Relative Temp Index, Mech w/o impact	80	°C	UL 746B

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