ELECTRICAL
PROPERTIES | TYPICAL VALUES | UNITS | TEST METHODS |
---|---|---|---|
Dielectric Constant (Dk), 1.1 GHz | 3.66 | - | ASTM ES 7-83 |
Dissipation Factor (Df), 1.1 GHz | 0.0094 | - | ASTM ES 7-83 |
LNP KONDUIT DTK22 compound is based on Polycarbonate (PC) resin containing minerals. Added features of this grade include: Thermally Conductive and Electrically Insulative.
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PROPERTIES | TYPICAL VALUES | UNITS | TEST METHODS |
---|---|---|---|
Dielectric Constant (Dk), 1.1 GHz | 3.66 | - | ASTM ES 7-83 |
Dissipation Factor (Df), 1.1 GHz | 0.0094 | - | ASTM ES 7-83 |
PROPERTIES | TYPICAL VALUES | UNITS | TEST METHODS |
---|---|---|---|
UL Yellow Card Link | View | - | - |
UL Recognized, 94HB Flame Class Rating | ≥0.5 | mm | UL 94 |
Glow Wire Flammability Index, 0.8 mm | 850 | °C | IEC 60695-2-12 |
Glow Wire Flammability Index, 1.0 mm | 875 | °C | IEC 60695-2-12 |
Glow Wire Ignitability Temperature, 0.8 mm | 850 | °C | IEC 60695-2-13 |
Glow Wire Ignitability Temperature, 1.0 mm | 850 | °C | IEC 60695-2-13 |
PROPERTIES | TYPICAL VALUES | UNITS | TEST METHODS |
---|---|---|---|
Izod Impact, unnotched, 23°C | 700 | J/m | ASTM D4812 |
Izod Impact, notched, 23°C | 150 | J/m | ASTM D256 |
Izod Impact, unnotched 80*10*4 +23°C | 41 | kJ/m² | ISO 180/1U |
Izod Impact, notched 80*10*4 +23°C | 13 | kJ/m² | ISO 180/1A |
PROPERTIES | TYPICAL VALUES | UNITS | TEST METHODS |
---|---|---|---|
Drying Temperature | 120 | °C | |
Drying Time | 2 - 4 | Hrs | |
Maximum Moisture Content | 0.02 | % | |
Melt Temperature | 260 - 300 | °C | |
Nozzle Temperature | 260 - 290 | °C | |
Front - Zone 3 Temperature | 260 - 290 | °C | |
Middle - Zone 2 Temperature | 260 - 290 | °C | |
Rear - Zone 1 Temperature | 250 - 280 | °C | |
Hopper Temperature | 60 - 80 | °C | |
Mold Temperature | 80 - 120 | °C |
PROPERTIES | TYPICAL VALUES | UNITS | TEST METHODS |
---|---|---|---|
Tensile Stress, brk, Type I, 5 mm/min | 41 | MPa | ASTM D638 |
Tensile Strain, brk, Type I, 5 mm/min | 5 | % | ASTM D638 |
Tensile Modulus, 5 mm/min | 3830 | MPa | ASTM D638 |
Flexural Stress, yld, 1.3 mm/min, 50 mm span | 79 | MPa | ASTM D790 |
Flexural Stress, brk, 1.3 mm/min, 50 mm span | 77 | MPa | ASTM D790 |
Flexural Modulus, 1.3 mm/min, 50 mm span | 3160 | MPa | ASTM D790 |
Tensile Stress, break, 5 mm/min | 42 | MPa | ISO 527 |
Tensile Strain, break, 5 mm/min | 4.1 | % | ISO 527 |
Tensile Modulus, 1 mm/min | 3880 | MPa | ISO 527 |
Flexural Stress, break, 2 mm/min | 81 | MPa | ISO 178 |
Flexural Modulus, 2 mm/min | 4180 | MPa | ISO 178 |
Impact Strength | 13 - 48 | kJ/m² | ISO R179 |
PROPERTIES | TYPICAL VALUES | UNITS | TEST METHODS |
---|---|---|---|
Density | 1.46 | g/cm³ | ASTM D792 |
Mold Shrinkage, flow, 24 hrs | 0.41 | % | ASTM D955 |
Mold Shrinkage, xflow, 24 hrs | 0.39 | % | ASTM D955 |
Moisture Absorption (23°C / 50% RH) | 0.03 | % | ISO 62 |
PROPERTIES | TYPICAL VALUES | UNITS | TEST METHODS |
---|---|---|---|
HDT, 0.45 MPa, 3.2 mm | 127 | °C | ASTM D648 |
HDT, 1.82 MPa, 3.2 mm | 121 | °C | ASTM D648 |
CTE, 40°C to 120°C, flow | 5.3E-05 | 1/°C | ASTM E831 |
CTE, 40°C to 120°C, xflow | 8.5E-05 | 1/°C | ASTM E831 |
Thermal Conductivity through-plane, 60*60*3mm plaque | 0.3 | W/m-K | ISO 22007-2 |
Thermal Conductivity in-plane, 60*60*3mm plaque | 1.3 | W/m-K | ISO 22007-2 |
Thermal Conductivity through-plane, 10*10*3mm sample | 0.6 | W/m-K | ASTM E1461-07 |
Thermal Conductivity in-plane, 25*0.4mm disc | 2 | W/m-K | ASTM E1461-07 |
HDT/Bf, 0.45 MPa Flatw 80*10*4 sp=64mm | 128 | °C | ISO 75/Bf |
HDT/Af, 1.8 MPa Flatw 80*10*4 sp=64mm | 119 | °C | ISO 75/Af |
Relative Temp Index, Elec | 80 | °C | UL 746B |
Relative Temp Index, Mech w/impact | 80 | °C | UL 746B |
Relative Temp Index, Mech w/o impact | 80 | °C | UL 746B |
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