LNP KONDUIT WTF2C compound is based on Polybutylene Terephthalate (PBT) resin containing mineral and glass fiber. Added features of this grade include Thermally Conductive, Electrically Insulative, CTI-0 and having a stable di-electric property over a wide temperature range.
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| PROPERTIES | TYPICAL VALUES | UNITS | TEST METHODS |
|---|---|---|---|
| Comparative Tracking Index | 600 | V | IEC 60112 |
| Surface Resistivity, ROA | >1.0E-11 | Ω | IEC 60093 |
| Volume Resistivity | >1.0E-15 | Ω.cm | IEC 60093 |
| Surface Resistivity | >1.0E-11 | Ω | ASTM D257 |
| Volume Resistivity | >1.0E-15 | Ω.cm | ASTM D257 |
| Comparative Tracking Index (UL) {PLC} | 0 | PLC Code | UL 746A |
| PROPERTIES | TYPICAL VALUES | UNITS | TEST METHODS |
|---|---|---|---|
| Izod Impact, unnotched 80*10*4 +23°C | 26 | kJ/m² | ISO 180/1U |
| Izod Impact, notched 80*10*4 +23°C | 7 | kJ/m² | ISO 180/1A |
| Izod Impact, notched, 23°C | 52 | J/m | ASTM D256 |
| PROPERTIES | TYPICAL VALUES | UNITS | TEST METHODS |
|---|---|---|---|
| Drying Temperature | 110 - 120 | °C | |
| Drying Time | 2 - 3 | Hrs | |
| Drying Time (Cumulative) | 2 | Hrs | |
| Maximum Moisture Content | 0.02 | % | |
| Melt Temperature | 265 - 275 | °C | |
| Rear - Zone 1 Temperature | 240 - 250 | °C | |
| Middle - Zone 2 Temperature | 250 - 260 | °C | |
| Front - Zone 3 Temperature | 260 - 270 | °C | |
| Nozzle Temperature | 265 - 275 | °C | |
| Mold Temperature | 80 - 100 | °C | |
| Back Pressure | 0.3 - 0.7 | MPa | |
| Screw Speed | 60 - 100 | rpm |
| PROPERTIES | TYPICAL VALUES | UNITS | TEST METHODS |
|---|---|---|---|
| Tensile Modulus, 1 mm/min | 7000 | MPa | ISO 527 |
| Tensile Stress, break, 5 mm/min | 64 | MPa | ISO 527 |
| Tensile Strain, yield, 5 mm/min | 2.2 | % | ISO 527 |
| Tensile Strain, break, 5 mm/min | 2.2 | % | ISO 527 |
| Tensile Modulus, 5 mm/min | 6400 | MPa | ASTM D638 |
| Tensile Stress, brk, Type I, 5 mm/min | 58 | MPa | ASTM D638 |
| Tensile Strain, yld, Type I, 5 mm/min | 2.6 | % | ASTM D638 |
| Tensile Strain, brk, Type I, 5 mm/min | 2.6 | % | ASTM D638 |
| Flexural Modulus, 1.3 mm/min, 50 mm span | 7200 | MPa | ASTM D790 |
| Flexural Strength, 1.3 mm/min, 50 mm span | 102 | MPa | ASTM D790 |
| PROPERTIES | TYPICAL VALUES | UNITS | TEST METHODS |
|---|---|---|---|
| Density | 2.23 | g/cm³ | ISO 1183 |
| Moisture Absorption, (23°C/50% RH/24hrs) | 0.03 | % | ISO 62-4 |
| Moisture Absorption, (23°C/50% RH/Equilibrium) | 0.06 | % | ISO 62-4 |
| Water Absorption, (23°C/24hrs) | 0.073 | % | ISO 62-1 |
| Mold Shrinkage, flow, 24 hrs | 0.95 | % | ASTM D955 |
| Mold Shrinkage, xflow, 24 hrs | 0.57 | % | ASTM D955 |
| Water Absorption, (23°C/24hrs) | 0.073 | % | ASTM D570 |
| Specific Gravity | 2.23 | - | ASTM D792 |
| Mold Shrinkage, flow | 0.43 | % | SABIC method |
| Mold Shrinkage, xflow | 0.73 | % | SABIC method |
| PROPERTIES | TYPICAL VALUES | UNITS | TEST METHODS |
|---|---|---|---|
| HDT/Af, 1.8 MPa Flatw 80*10*4 sp=64mm | 172 | °C | ISO 75/Af |
| Vicat Softening Temp, Rate B/50 | 208 | °C | ISO 306 |
| Vicat Softening Temp, Rate B/120 | 208 | °C | ISO 306 |
| Thermal Conductivity | 1.03 | W/m-°C | ISO 8302 |
| Thermal Conductivity in-plane, 60*60*3mm plaque | 1.2 | W/m-K | ISO 22007-2 |
| Thermal Conductivity through-plane, 60*60*3mm plaque | 0.9 | W/m-K | ISO 22007-2 |
| CTE, -40°C to 150°C, flow | 4.8E-5 | 1/°C | ISO 11359-2 |
| CTE, -40°C to 150°C, xflow | 1.1E-4 | 1/°C | ISO 11359-2 |
| HDT/Bf, 0.45 MPa Flatw 80*10*4 sp=64mm | 209 | °C | ISO 75/Bf |
| HDT, 1.82 MPa, 3.2mm, unannealed | 172 | °C | ASTM D648 |
| HDT, 0.45 MPa, 3.2 mm, unannealed | 209 | °C | ASTM D648 |
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