LNP™ STAT-KON™ Compound ZJK20I

LNP STAT-KON ZJK20I is a static dissipative CNT compound based on polyphenylene ether (PPE) + polystyrene (PS) resin with low particulate count and good high heat properties. This material is an intended for IC tray, Wafer cassette and Slider tray parts in the semiconductor industry.

Product Family

LNP™ COMPOUNDS AND PC COPOLYMER RESINS

Polymer Family

Polyphenylene Ether + PS (PPE+PS)

Processing Technology

Injection Molding

Where to buy

You can get in touch with us in these regions to buy the material

Colors

All colors are customizable. Refer our ColorXpress tool to check color availability

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Features

Key characteristics of the material

Dimensional stability
Electrically Conductive
Good Processability
No PFAS intentionally added

Industry

Material previously used in

Electrical
Electronic Components
Material Handling

Applications

Possible usage of material

ATM/Ticket Machine
Document Handling
Electrical Components & Infrastructure
Electrical
Electronic Components
Electronic Material Handling
Electronic Material
Electronics
Enclosure/Housing/Cover
Enclosures
ESD Tote/Cart
Semiconductor
Sensor
Thermoplastic
ic tray
disk caddy
process tray
jedec tray

Technical Datasheet Data

View different characteristics of the material at a standard test conditions

Region

ELECTRICAL

PROPERTIES	TYPICAL VALUES	UNITS	TEST METHODS
Surface Resistivity	1E+05 - 1E+08	Ω	ANSI/ESD STM11.11
Surface Resistivity	1E+05 - 1E+08	Ω	ASTM D257
Volume Resistivity	1E+00 - 1E+02	Ω.cm	SABIC method

IMPACT

PROPERTIES	TYPICAL VALUES	UNITS	TEST METHODS
*Izod Impact, unnotched 80104 +23°C*	30	kJ/m²	ISO 180/1U
*Izod Impact, notched 80104 +23°C*	4	kJ/m²	ISO 180/1A
Izod Impact, unnotched, 23°C	345	J/m	ASTM D4812
Izod Impact, notched, 23°C	38	J/m	ASTM D256

INJECTION MOLDING

PROPERTIES	TYPICAL VALUES	UNITS
Drying Temperature	80 - 100	°C
Drying Time	2 - 4	Hrs
Maximum Moisture Content	0.02	%
Hopper Temperature	40	°C
Melt Temperature	310 - 320	°C
Rear - Zone 1 Temperature	300 - 310	°C
Middle - Zone 2 Temperature	300 - 310	°C
Front - Zone 3 Temperature	310 - 320	°C
Nozzle Temperature	310 - 320	°C
Mold Temperature	100 - 120	°C
Back Pressure	0.3 - 0.7	MPa
Screw speed (Circumferential speed)	0.15 - 0.20	m/s

MECHANICAL

PROPERTIES	TYPICAL VALUES	UNITS	TEST METHODS
Tensile Stress, break, 50 mm/min	85	MPa	ISO 527
Tensile Strain, break, 50 mm/min	3.6	%	ISO 527
Tensile Modulus, 1 mm/min	4200	MPa	ISO 527
Flexural Strength, 2 mm/min	124	MPa	ISO 178
Flexural Modulus, 2 mm/min	4020	MPa	ISO 178
Tensile Stress, yld, Type I, 50 mm/min	85	MPa	ASTM D638
Tensile Stress, brk, Type I, 50 mm/min	82	MPa	ASTM D638
Tensile Strain, yld, Type I, 50 mm/min	4.2	%	ASTM D638
Tensile Strain, brk, Type I, 50 mm/min	5	%	ASTM D638
Tensile Modulus, 50 mm/min	4320	MPa	ASTM D638
Flexural Strength, 1.3 mm/min, 50 mm span	133	MPa	ASTM D790
Flexural Modulus, 1.3 mm/min, 50 mm span	4320	MPa	ASTM D790

PHYSICAL

PROPERTIES	TYPICAL VALUES	UNITS	TEST METHODS
Melt Volume Rate, MVR at 300°C/10.0 kg	11	cm³/10 min	ISO 1133
Density	1.15	g/cm³	ISO 1183
Mold Shrinkage, xflow	0.31	%	SABIC method
Mold Shrinkage, flow	0.27	%	SABIC method
Specific Gravity	1.15	-	ASTM D792

THERMAL

PROPERTIES	TYPICAL VALUES	UNITS	TEST METHODS
*HDT/Bf, 0.45 MPa Flatw 80104 sp=64mm*	164	°C	ISO 75/Bf
*HDT/Af, 1.8 MPa Flatw 80104 sp=64mm*	153	°C	ISO 75/Af
CTE, -40°C to 40°C, flow	4.7E-05	1/°C	ISO 11359-2
CTE, -40°C to 40°C, xflow	6.1E-05	1/°C	ISO 11359-2
Ball Pressure Test, 125°C +/- 2°C	PASS	-	IEC 60695-10-2
HDT, 1.82 MPa, 3.2mm, unannealed	153	°C	ASTM D648
HDT, 0.45 MPa, 3.2 mm, unannealed	164	°C	ASTM D648

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