LNP™ THERMOCOMP™ AM Compound DC0041AA51

LNP THERMOCOMP DC0041AA51 compound is based on PC Copolymer Resin containing 20% carbon fiber for Large Format Additive Manufacturing (LFAM) applications. Added features of this grade include: Higher Stiffness vs. glass fiber, Higher Strength, Higher Temperature Performance and Higher Throughput compared to ABS and PPE, as well as Smooth Surface Finish. This halogen-free flame retardant resin could meet requirements of NFPA 701.

Product Family

  • ADDITIVE MANUFACTURING

Polymer Family

  • Polycarbonate (PC)

Processing Technology

  • Large Format Additive Manufacturing (LFAM)