LNP™ THERMOCOMP™ Compound 5C004

LNP THERMOCOMP 5C004 compound is based on Polyvinylidene Fluoride (PVDF) resin containing 20% carbon fiber. Added features of this grade include: Electrically Conductive.

Product Family

  • LNP™ COMPOUNDS AND PC COPOLYMER RESINS

Polymer Family

  • Polyvinylidene Fluoride (PVDF)

Processing Technology

  • Injection Molding