LNP™ THERMOCOMP™ Compound BF004

LNP THERMOCOMP BF004 compound is based on Styrene-Acrylonitrile (SAN) resin containing 20% glass fiber.

Product Family

  • LNP™ COMPOUNDS AND PC COPOLYMER RESINS

Polymer Family

  • Styrene Acrylonitrile (SAN)

Processing Technology

  • Injection Molding