LNP™ THERMOCOMP™ Compound CX05470

LNP THERMOCOMP CX05470 compound is based on Polystyrene (PS) resin containing 20% glass fiber.

Product Family

  • LNP™ COMPOUNDS AND PC COPOLYMER RESINS

Polymer Family

  • Polystyrene (PS)

Processing Technology

  • Injection Molding