LNP™ THERMOCOMP™ Compound D10001VI

LNP THERMOCOMP D10001VI is based on Polycarbonate (PC) resin. It is colorable, non Chlorinated and non Brominated, UL94 V0@0.8mm LDS compound for antenna or electric circuit manufacturing. Added features of this material include good process-ability, high impact strength, robust flame retardant for thin-wall design, good color-ability.

Product Family

  • LNP™ COMPOUNDS AND PC COPOLYMER RESINS

Polymer Family

  • Polycarbonate (PC)

Processing Technology

  • Injection Molding