LNP™ THERMOCOMP™ Compound D451

LNP THERMOCOMP D451 compound is based on Polycarbonate (PC) resin containing 40% glass fiber. Added features of this grade include: High Modulus, Low Warpage, Good Ductility, Non-Brominated & Non-Chlorinated Flame Retardant.

Product Family

LNP™ COMPOUNDS AND PC COPOLYMER RESINS

Polymer Family

Polycarbonate (PC)

Processing Technology

Injection Molding

Where to buy

You can get in touch with us in these regions to buy the material

Colors

All colors are customizable. Refer our ColorXpress tool to check color availability

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Features

Key characteristics of the material

Flame Retardant
High stiffness/Strength
Impact resistant
Low Warpage
Non Cl/Br flame retardant

Industry

Material previously used in

Building Component
Electrical
Mobile Phone - Computer - Tablets
Personal Accessory

Applications

Possible usage of material

Enclosures
Personal Computing
Wireless Communications
consumer electric housing
mobile phone enclosure
laptop housing
wearable device housing
tablet pc housing

Technical Datasheet Data

View different characteristics of the material at a standard test conditions

Region

FLAME CHARACTERISTICS

PROPERTIES	TYPICAL VALUES	UNITS	TEST METHODS
UL Yellow Card Link	View	-	-
UL Recognized, 94V-0 Flame Class Rating	≥0.8	mm	UL 94
UL Recognized, 94V-1 Flame Class Rating	≥0.6	mm	UL 94

IMPACT

PROPERTIES	TYPICAL VALUES	UNITS	TEST METHODS
Izod Impact, unnotched, 23°C	521	J/m	ASTM D4812
Izod Impact, notched, 23°C	140	J/m	ASTM D256
*Charpy 23°C, V-notch Edgew 80104 sp=62mm*	13	kJ/m²	ISO 179/1eA
*Charpy 23°C, Unnotch Edgew 80104 sp=62mm*	33	kJ/m²	ISO 179/1eU

INJECTION MOLDING

PROPERTIES	TYPICAL VALUES	UNITS
Drying Temperature	110	°C
Drying Time	3 - 6	Hrs
Maximum Moisture Content	0.02	%
Melt Temperature	285 - 310	°C
Nozzle Temperature	285 - 305	°C
Front - Zone 3 Temperature	280 - 300	°C
Middle - Zone 2 Temperature	270 - 290	°C
Rear - Zone 1 Temperature	260 - 280	°C
Mold Temperature	80 - 110	°C
Back Pressure	0.1 - 0.3	MPa
Screw Speed	50 - 90	rpm

MECHANICAL

PROPERTIES	TYPICAL VALUES	UNITS	TEST METHODS
Tensile Stress, brk, Type I, 5 mm/min	143	MPa	ASTM D638
Tensile Strain, brk, Type I, 5 mm/min	2.3	%	ASTM D638
Tensile Modulus, 5 mm/min	11720	MPa	ASTM D638
Flexural Stress, brk, 1.3 mm/min, 50 mm span	186	MPa	ASTM D790
Flexural Modulus, 1.3 mm/min, 50 mm span	9750	MPa	ASTM D790

PHYSICAL

PROPERTIES	TYPICAL VALUES	UNITS	TEST METHODS
Density	1.52	g/cm³	ASTM D792
Mold Shrinkage, flow, 24 hrs	0.1 - 0.25	%	ASTM D955
Mold Shrinkage, xflow, 24 hrs	0.1 - 0.25	%	ASTM D955
Melt Flow Rate, 300°C/2.16 kgf	17.9	g/10 min	ASTM D1238
Melt Flow Rate, 300°C/5.0 kgf	57	g/10 min	ASTM D1238
Melt Volume Rate, MVR at 300°C/5.0 kg	42	cm³/10 min	ASTM D1238
Melt Volume Rate, MVR at 300°C/2.16 kg	14	cm³/10 min	ISO 1133

THERMAL

PROPERTIES	TYPICAL VALUES	UNITS	TEST METHODS
HDT, 1.82 MPa, 3.2mm, unannealed	114	°C	ASTM D648
CTE, -40°C to 40°C, flow	1.54E-05	1/°C	ASTM E831
CTE, -40°C to 40°C, xflow	5.63E-05	1/°C	ASTM E831
Relative Temp Index, Elec	80	°C	UL 746B
Relative Temp Index, Mech w/impact	80	°C	UL 746B
Relative Temp Index, Mech w/o impact	80	°C	UL 746B

Curve Data

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CAE Cards