LNP™ THERMOCOMP™ Compound D551

LNP THERMOCOMP D551 compound is based on Polycarbonate (PC) resin containing 50% glass fiber. Added features of this grade include: High Modulus, Low Warpage, Good Ductility, Non-Brominated & Non-Chlorinated Flame Retardant.

Product Family

  • LNP™ COMPOUNDS AND PC COPOLYMER RESINS

Polymer Family

  • Polycarbonate (PC)

Processing Technology

  • Injection Molding