LNP™ THERMOCOMP™ Compound DC0041PQ

LNP THERMOCOMP DC0041PQ compound is based on Polycarbonate (PC) resin containing 20% carbon fiber. Added features of this grade include: Electrically Conductive, Non-Brominated, Non- Chlorinated Flame Retardant, Exceptional Processing.

Product Family

  • LNP™ COMPOUNDS AND PC COPOLYMER RESINS

Polymer Family

  • Polycarbonate (PC)

Processing Technology

  • Injection Molding