LNP™ THERMOCOMP™ Compound DC004E

LNP THERMOCOMP DC004E compound is based on Polycarbonate (PC) resin containing 20% carbon fiber. Added features of this grade include: Easy Molding, Electrically Conductive.

Product Family

  • LNP™ COMPOUNDS AND PC COPOLYMER RESINS

Polymer Family

  • Polycarbonate (PC)

Processing Technology

  • Injection Molding