LNP™ THERMOCOMP™ Compound DC006

LNP THERMOCOMP DC006 compound is based on Polycarbonate (PC) resin containing 30% carbon fiber. Added features of this grade include: Electrically Conductive.

Product Family

  • LNP™ COMPOUNDS AND PC COPOLYMER RESINS

Polymer Family

  • Polycarbonate (PC)

Processing Technology

  • Injection Molding