LNP™ THERMOCOMP™ Compound DF002

LNP THERMOCOMP DF002 compound is based on Polycarbonate (PC) resin containing 10% glass fiber.

Product Family

  • LNP™ COMPOUNDS AND PC COPOLYMER RESINS

Polymer Family

  • Polycarbonate (PC)

Processing Technology

  • Injection Molding