LNP™ THERMOCOMP™ Compound DF003E

LNP THERMOCOMP DF003E compound is based on Polycarbonate (PC) resin containing 15% glass fiber. Added features of this grade include: Easy Molding.

Product Family

  • LNP™ COMPOUNDS AND PC COPOLYMER RESINS

Polymer Family

  • Polycarbonate (PC)

Processing Technology

  • Injection Molding