LNP™ THERMOCOMP™ Compound DF004RXP
LNP THERMOCOMP DF004RXP compound is based on Polycarbonate (PC) resin containing 20% glass fiber. Added features of this grade include: Mold Release.
Product Family
- LNP™ COMPOUNDS AND PC COPOLYMER RESINS
Polymer Family
- Polycarbonate (PC)
Processing Technology
- Injection Molding