LNP™ THERMOCOMP™ Compound DF004RXP

LNP THERMOCOMP DF004RXP compound is based on Polycarbonate (PC) resin containing 20% glass fiber. Added features of this grade include: Mold Release.

Product Family

  • LNP™ COMPOUNDS AND PC COPOLYMER RESINS

Polymer Family

  • Polycarbonate (PC)

Processing Technology

  • Injection Molding