LNP™ THERMOCOMP™ Compound DF008

LNP THERMOCOMP DF008 compound is based on Polycarbonate (PC) resin containing 40% glass fiber.

Product Family

  • LNP™ COMPOUNDS AND PC COPOLYMER RESINS

Polymer Family

  • Polycarbonate (PC)

Processing Technology

  • Injection Molding