LNP™ THERMOCOMP™ Compound DX06094

LNP THERMOCOMP DX06094 compound is based on Polycarbonate (PC) resin containing 30% glass fiber. Added features of this grade include: High Impact, Non- Brominated & Non-Chlorinated Flame Retardant and Mold Release.

Product Family

  • LNP™ COMPOUNDS AND PC COPOLYMER RESINS

Polymer Family

  • Polycarbonate (PC)

Processing Technology

  • Injection Molding