LNP THERMOCOMP DX09309 compound is based on Polycarbonate (PC) resin containing proprietary fillers. Added features of this grade include: High Dielectric Constant.
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| PROPERTIES | TYPICAL VALUES | UNITS | TEST METHODS |
|---|---|---|---|
| Dielectric Constant, 1.1 GHz | 8 | - | SABIC method |
| Dissipation Factor, 1.1 GHz | 0.01 | - | SABIC method |
| PROPERTIES | TYPICAL VALUES | UNITS | TEST METHODS |
|---|---|---|---|
| Izod Impact, notched, 23°C | 68 | J/m | ASTM D256 |
| PROPERTIES | TYPICAL VALUES | UNITS | TEST METHODS |
|---|---|---|---|
| Drying Temperature | 90 - 110 | °C | |
| Drying Time | 3 - 5 | Hrs | |
| Melt Temperature | 280 - 320 | °C | |
| Nozzle Temperature | 280 - 320 | °C | |
| Front - Zone 3 Temperature | 280 - 320 | °C | |
| Middle - Zone 2 Temperature | 280 - 320 | °C | |
| Rear - Zone 1 Temperature | 250 - 280 | °C | |
| Mold Temperature | 90 - 120 | °C | |
| Back Pressure | 1 - 5 | MPa | |
| Screw Speed | 30 - 100 | rpm |
| PROPERTIES | TYPICAL VALUES | UNITS | TEST METHODS |
|---|---|---|---|
| Tensile Stress, brk, Type I, 5 mm/min | 27 | MPa | ASTM D638 |
| Tensile Strain, brk, Type I, 5 mm/min | 4.2 | % | ASTM D638 |
| Flexural Stress | 60 | MPa | ASTM D790 |
| Flexural Modulus | 2490 | MPa | ASTM D790 |
| PROPERTIES | TYPICAL VALUES | UNITS | TEST METHODS |
|---|---|---|---|
| Specific Gravity | 2.24 | - | ASTM D792 |
| Mold Shrinkage, flow, 3.2 mm | 0.65 | % | SABIC method |
| Mold Shrinkage, xflow, 3.2 mm | 0.56 | % | SABIC method |
| Melt Volume Rate, MVR at 280°C/2.16kg | 15.7 | cm³/10 min | ASTM D1238 |
| PROPERTIES | TYPICAL VALUES | UNITS | TEST METHODS |
|---|---|---|---|
| HDT, 1.82 MPa, 6.4 mm, unannealed | 103 | °C | ASTM D648 |
| HDT, 1.82 MPa, 3.2mm, unannealed | 97 | °C | ASTM D648 |
| CTE, -40°C to 40°C, flow | 6.2E-05 | 1/°C | ASTM E831 |
| CTE, -40°C to 40°C, xflow | 6.4E-05 | 1/°C | ASTM E831 |
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