LNP™ THERMOCOMP™ Compound DX10311

LNP THERMOCOMP DX10311 compound is based on Polycarbonate (PC) resin containing 30% glass fiber. Added features of this grade include: High Modulus and Good Ductility.

Product Family

  • LNP™ COMPOUNDS AND PC COPOLYMER RESINS

Polymer Family

  • Polycarbonate (PC)

Processing Technology

  • Injection Molding