LNP™ THERMOCOMP™ Compound DZ004

LNP THERMOCOMP DZ004 compound is based on Polycarbonate (PC) resin containing 20% milled glass.

Product Family

  • LNP™ COMPOUNDS AND PC COPOLYMER RESINS

Polymer Family

  • Polycarbonate (PC)

Processing Technology

  • Injection Molding