LNP™ THERMOCOMP™ Compound EC008

LNP THERMOCOMP EC008 compound is based on Polyetherimide (PEI) resin containing 40% carbon fiber. Added features of this grade include: Electrically Conductive.

Product Family

  • LNP™ COMPOUNDS AND PC COPOLYMER RESINS

Polymer Family

  • Polyetherimide (PEI)

Processing Technology

  • Injection Molding