ELECTRICAL
PROPERTIES | TYPICAL VALUES | UNITS | TEST METHODS |
---|---|---|---|
Surface Resistivity | 1.E+01 - 1.E+03 | Ω | ASTM D257 |
LNP THERMOCOMP EC008 compound is based on Polyetherimide (PEI) resin containing 40% carbon fiber. Added features of this grade include: Electrically Conductive.
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PROPERTIES | TYPICAL VALUES | UNITS | TEST METHODS |
---|---|---|---|
Surface Resistivity | 1.E+01 - 1.E+03 | Ω | ASTM D257 |
PROPERTIES | TYPICAL VALUES | UNITS | TEST METHODS |
---|---|---|---|
Izod Impact, unnotched 80*10*4 +23°C | 25 | kJ/m² | ISO 180/1U |
Izod Impact, notched 80*10*4 +23°C | 8 | kJ/m² | ISO 180/1A |
PROPERTIES | TYPICAL VALUES | UNITS | TEST METHODS |
---|---|---|---|
Drying Temperature | 150 | °C | |
Drying Time | 4 - 6 | Hrs | |
Maximum Moisture Content | 0.02 | % | |
Melt Temperature | 360 - 400 | °C | |
Rear - Zone 1 Temperature | 360 - 380 | °C | |
Middle - Zone 2 Temperature | 370 - 390 | °C | |
Front - Zone 3 Temperature | 380 - 400 | °C | |
Nozzle Temperature | 390 - 400 | °C | |
Mold Temperature | 140 - 180 | °C | |
Back Pressure | 0.3 - 0.7 | MPa | |
Screw speed (Circumferential speed) | 0.2 - 0.3 | m/s | |
Vent Depth | 0.025 - 0.076 | mm |
PROPERTIES | TYPICAL VALUES | UNITS | TEST METHODS |
---|---|---|---|
Tensile Stress, yield, 5 mm/min | 211 | MPa | ISO 527 |
Tensile Strain, break, 5 mm/min | 0.9 | % | ISO 527 |
Tensile Modulus, 1 mm/min | 27000 | MPa | ISO 527 |
Flexural Stress, yield, 2 mm/min | 286 | MPa | ISO 178 |
Flexural Modulus, 2 mm/min | 22200 | MPa | ISO 178 |
PROPERTIES | TYPICAL VALUES | UNITS | TEST METHODS |
---|---|---|---|
Mold Shrinkage, flow, 24 hrs | 0.1 - 0.3 | % | ASTM D955 |
Mold Shrinkage, xflow, 24 hrs | 0.1 - 0.5 | % | ASTM D955 |
Density | 1.44 | g/cm³ | ISO 1183 |
PROPERTIES | TYPICAL VALUES | UNITS | TEST METHODS |
---|---|---|---|
HDT/Af, 1.8 MPa Flatw 80*10*4 sp=64mm | 214 | °C | ISO 75/Af |
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