LNP™ THERMOCOMP™ Compound EF002EXH

LNP THERMOCOMP EF002EXH compound is based on Polyetherimide (PEI) resin containing 10% glass fiber. Added features of this grade include: Healthcare.

Product Family

  • LNP™ COMPOUNDS AND PC COPOLYMER RESINS

Polymer Family

  • Polyetherimide (PEI)

Processing Technology

  • Injection Molding