LNP™ THERMOCOMP™ Compound EF004

LNP THERMOCOMP EF004 compound is based on Polyetherimide (PEI) resin containing 20% glass fiber.

Product Family

  • LNP™ COMPOUNDS AND PC COPOLYMER RESINS

Polymer Family

  • Polyetherimide (PEI)

Processing Technology

  • Injection Molding