LNP™ THERMOCOMP™ Compound EF004XXP

LNP THERMOCOMP EF004XXP compound is based on Polyetherimide (PEI) resin containing 20% glass fiber. Added features of this grade include: High Modulus, High Strength, Good Dimension Stability and Good Warpage Control.

Product Family

  • LNP™ COMPOUNDS AND PC COPOLYMER RESINS

Polymer Family

  • Polyetherimide (PEI)

Processing Technology

  • Injection Molding