LNP™ THERMOCOMP™ Compound EF006H

LNP THERMOCOMP EF006H compound is based on Polyetherimide (PEI) resin containing 30% glass fiber. Added features of this grade include: Healthcare.

Product Family

  • LNP™ COMPOUNDS AND PC COPOLYMER RESINS

Polymer Family

  • Polyetherimide (PEI)

Processing Technology

  • Injection Molding