LNP™ THERMOCOMP™ Compound GF006

LNP THERMOCOMP GF006 compound is based on Polysulfone (PSU) resin containing 30% glass fiber.

Product Family

  • LNP™ COMPOUNDS AND PC COPOLYMER RESINS

Polymer Family

  • Polysulfone (PSU)

Processing Technology

  • Injection Molding