LNP™ THERMOCOMP™ Compound HF008

LNP THERMOCOMP HF008 compound is based on Nylon 11 resin containing 40% glass fiber.

Product Family

  • LNP™ COMPOUNDS AND PC COPOLYMER RESINS

Polymer Family

  • Polyamide 11 (Nylon 11)

Processing Technology

  • Injection Molding