LNP™ THERMOCOMP™ Compound IB008

LNP THERMOCOMP IB008 compound is based on Nylon 6/12 resin containing 40% glass bead.

Product Family

  • LNP™ COMPOUNDS AND PC COPOLYMER RESINS

Polymer Family

  • Polyamide 612 (Nylon 612)

Processing Technology

  • Injection Molding