LNP™ THERMOCOMP™ Compound JF002R

LNP THERMOCOMP JF002R compound is based on Polyethersulfone (PES) resin containing 10% glass fiber/glass bead. Added features of this grade include: Mold Release.

Product Family

  • LNP™ COMPOUNDS AND PC COPOLYMER RESINS

Polymer Family

  • Polyethersulfone (PESU)

Processing Technology

  • Injection Molding