LNP™ THERMOCOMP™ Compound JF004EXP
LNP THERMOCOMP JF004EXP compound is based on Polyethersulfone (PES) resin containing 20% glass fiber. Added features of this grade include: Easy Molding.
Product Family
- LNP™ COMPOUNDS AND PC COPOLYMER RESINS
Polymer Family
- Polyethersulfone (PESU)
Processing Technology
- Injection Molding