LNP™ THERMOCOMP™ Compound JF004EXP

LNP THERMOCOMP JF004EXP compound is based on Polyethersulfone (PES) resin containing 20% glass fiber. Added features of this grade include: Easy Molding.

Product Family

  • LNP™ COMPOUNDS AND PC COPOLYMER RESINS

Polymer Family

  • Polyethersulfone (PESU)

Processing Technology

  • Injection Molding