LNP™ THERMOCOMP™ Compound JF006

LNP THERMOCOMP JF006 compound is based on Polyethersulfone (PES) resin containing 30% glass fiber.

Product Family

  • LNP™ COMPOUNDS AND PC COPOLYMER RESINS

Polymer Family

  • Polyethersulfone (PESU)

Processing Technology

  • Injection Molding