LNP™ THERMOCOMP™ Compound KB006

LNP THERMOCOMP KB006 compound is based on POM (Acetal) copolymer resin containing 30% glass bead.

Product Family

  • LNP™ COMPOUNDS AND PC COPOLYMER RESINS

Polymer Family

  • Acetal (POM) Copolymer

Processing Technology

  • Injection Molding