LNP™ THERMOCOMP™ Compound KFB11

LNP THERMOCOMP KFB11 compound is based on POM (Acetal) copolymer resin containing 5% glass fiber, 5% glass bead. Added features of this grade include: Low Warpage.

Product Family

  • LNP™ COMPOUNDS AND PC COPOLYMER RESINS

Polymer Family

  • Acetal (POM) Copolymer

Processing Technology

  • Injection Molding