LNP™ THERMOCOMP™ Compound LC006EX1
LNP THERMOCOMP LC006EX1 compound is based on Polyetheretherketone (PEEK) resin containing 30% post-industrial-recycled (PIR) carbon fiber. Added features of this grade include High Modulus, High impact, Easy Molding and Electrically Conductive.
Product Family
- LNP™ COMPOUNDS AND PC COPOLYMER RESINS
Polymer Family
- Polyetheretherketone (PEEK)
Processing Technology
- Injection Molding