LNP™ THERMOCOMP™ Compound LC006EX1

LNP THERMOCOMP LC006EX1 compound is based on Polyetheretherketone (PEEK) resin containing 30% post-industrial-recycled (PIR) carbon fiber. Added features of this grade include High Modulus, High impact, Easy Molding and Electrically Conductive.

Product Family

  • LNP™ COMPOUNDS AND PC COPOLYMER RESINS

Polymer Family

  • Polyetheretherketone (PEEK)

Processing Technology

  • Injection Molding