LNP™ THERMOCOMP™ Compound LC00AEX1

LNP THERMOCOMP LC00AEX1 compound is based on Polyetheretherketone (PEEK) resin containing 50% carbon fiber. Added features of this grade include: Electrically Conductive, Ultra High Modulus and Strength, Easy Molding, Excellent Wear Resistance and Low CTE.

Product Family

  • LNP™ COMPOUNDS AND PC COPOLYMER RESINS

Polymer Family

  • Polyetheretherketone (PEEK)

Processing Technology

  • Injection Molding