LNP™ THERMOCOMP™ Compound LF006EX1

LNP THERMOCOMP LF006EX1 compound is based on Polyetheretherketone (PEEK) resin containing 30% glass fiber. Added features of this grade include: Low warpage, Easy Molding.

Product Family

  • LNP™ COMPOUNDS AND PC COPOLYMER RESINS

Polymer Family

  • Polyetheretherketone (PEEK)

Processing Technology

  • Injection Molding