LNP™ THERMOCOMP™ Compound LF008EX1

LNP THERMOCOMP LF008EX1 compound is based on Polyetheretherketone (PEEK) resin containing 40% glass fiber. Added features of this grade include: High Modulus and Strength, Easy Molding and Low Warpage.

Product Family

  • LNP™ COMPOUNDS AND PC COPOLYMER RESINS

Polymer Family

  • Polyetheretherketone (PEEK)

Processing Technology

  • Injection Molding