LNP™ THERMOCOMP™ Compound LFW55EX1

LNP THERMOCOMP LFW55EX1 compound is based on Polyetheretherketone (PEEK) resin containing 25% glass fiber and 25% mineral. Added features of this material include: Easy Molding, Dimensional Stability.

Product Family

  • LNP™ COMPOUNDS AND PC COPOLYMER RESINS

Polymer Family

  • Polyetheretherketone (PEEK)

Processing Technology

  • Injection Molding