LNP™ THERMOCOMP™ Compound LX03447

LNP THERMOCOMP LX03447 compound is based on Polyetheretherketone (PEEK) resin containing 35% carbon fiber. Added features of this grade include: Electrically Conductive.

Product Family

  • LNP™ COMPOUNDS AND PC COPOLYMER RESINS

Polymer Family

  • Polyetheretherketone (PEEK)

Processing Technology

  • Injection Molding