LNP™ THERMOCOMP™ Compound MB008S

LNP THERMOCOMP MB008S compound is based on Polypropylene (PP) resin containing 40% glass bead. Added features of this grade include: Heat Stabilized.

Product Family

  • LNP™ COMPOUNDS AND PC COPOLYMER RESINS

Polymer Family

  • Polypropylene, Unspecified (PP, Unspecified)

Processing Technology

  • Injection Molding