LNP™ THERMOCOMP™ Compound MC004

LNP THERMOCOMP MC004 compound is based on Polypropylene (PP) resin containing 20% carbon fiber. Added features of this grade include: Electrically Conductive.

Product Family

  • LNP™ COMPOUNDS AND PC COPOLYMER RESINS

Polymer Family

  • Polypropylene, Unspecified (PP, Unspecified)

Processing Technology

  • Injection Molding