LNP™ THERMOCOMP™ Compound OC006

LNP THERMOCOMP OC006 compound is based on linear Polyphenylene Sulfide (PPS) resin containing 30% carbon fiber. Added features of this grade include: Electrically Conductive.

Product Family

  • LNP™ COMPOUNDS AND PC COPOLYMER RESINS

Polymer Family

  • Polyphenylene Sulfide, Linear (PPS, Linear)

Processing Technology

  • Injection Molding