LNP™ THERMOCOMP™ Compound PB006EQ

LNP THERMOCOMP PB006EQ compound is based on Nylon 6 resin containing 30% glass bead. Added features of this grade include: Reduced Moisture.

Product Family

  • LNP™ COMPOUNDS AND PC COPOLYMER RESINS

Polymer Family

  • Polyamide 6 (Nylon 6)

Processing Technology

  • Injection Molding