LNP™ THERMOCOMP™ Compound PFB55

LNP THERMOCOMP PFB55 compound is based on Nylon 6 resin containing 25% glass bead, 25% glass fiber.

Product Family

  • LNP™ COMPOUNDS AND PC COPOLYMER RESINS

Polymer Family

  • Polyamide 6 (Nylon 6)

Processing Technology

  • Injection Molding