LNP™ THERMOCOMP™ Compound QBF16

LNP THERMOCOMP QBF16 compound is based on Nylon 6/10 resin containing glass fiber. Added feature of this grade include: low specific gravity, high stiffness, low warpage, low moisture absorption, low dielectric constant.

Product Family

  • LNP™ COMPOUNDS AND PC COPOLYMER RESINS

Polymer Family

  • Polyamide 610 (Nylon 610)

Processing Technology

  • Injection Molding