LNP™ THERMOCOMP™ Compound QC008XXP

LNP THERMOCOMP QC008XXP compound is based on Nylon resin containing 40% carbon fiber. Added features of this grade include: Electrically Conductive, High Stiffness/Strength.

Product Family

  • LNP™ COMPOUNDS AND PC COPOLYMER RESINS

Polymer Family

  • Polyamide, Unspecified (Nylon, Unspecified)

Processing Technology

  • Injection Molding