LNP™ THERMOCOMP™ Compound QF007

LNP THERMOCOMP QF007 compound is based on Nylon 6/10 resin containing 35% glass fiber.

Product Family

  • LNP™ COMPOUNDS AND PC COPOLYMER RESINS

Polymer Family

  • Polyamide 610 (Nylon 610)

Processing Technology

  • Injection Molding